Dubin, V., Thomas, C., Baxter, N., Block, C., Chikarmane, V., McGregor, P., . . . Shankar, S. (2001). Engineering gap fill, microstructure and film composition of electroplated copper for on-chip metallization. Proceedings of the IEEE 2001 International Interconnect Technology Conference (Cat. No.01EX461), Interconnect Technology Conference, 2001. Proceedings of the IEEE 2001 International, Interconnect technology conference, 271. https://doi.org/10.1109/IITC.2001.930081
Παραπομπή σε μορφή Chicago (17η εκδ.)Dubin, V.M, et al. "Engineering Gap Fill, Microstructure and Film Composition of Electroplated Copper for On-chip Metallization." Proceedings of the IEEE 2001 International Interconnect Technology Conference (Cat. No.01EX461), Interconnect Technology Conference, 2001. Proceedings of the IEEE 2001 International, Interconnect Technology Conference 2001: 271. https://doi.org/10.1109/IITC.2001.930081.
Παραπομπή σε μορφή MLA (9th εκδ.)Dubin, V.M, et al. "Engineering Gap Fill, Microstructure and Film Composition of Electroplated Copper for On-chip Metallization." Proceedings of the IEEE 2001 International Interconnect Technology Conference (Cat. No.01EX461), Interconnect Technology Conference, 2001. Proceedings of the IEEE 2001 International, Interconnect Technology Conference, 2001, p. 271, https://doi.org/10.1109/IITC.2001.930081.