Conference
Engineering gap fill, microstructure and film composition of electroplated copper for on-chip metallization
| Τίτλος: | Engineering gap fill, microstructure and film composition of electroplated copper for on-chip metallization |
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| Συγγραφείς: | Dubin, V.M., Thomas, C.D., Baxter, N., Block, C., Chikarmane, V., McGregor, P., Jentz, D., Hong, K., Hearne, S., Zhi, C., Zierath, D., Miner, B., Kuhn, M., Budrevich, A., Simka, H., Shankar, S. |
| Πηγή: | Proceedings of the IEEE 2001 International Interconnect Technology Conference (Cat. No.01EX461) Interconnect technology conference Interconnect Technology Conference, 2001. Proceedings of the IEEE 2001 International. :271-273 2001 |
| Relation: | Proceedings of the IEEE 2001 International Interconnect Technology Conference |
| Βάση Δεδομένων: | IEEE Xplore Digital Library |
| ISBN: | 0780366786 9780780366787 |
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| DOI: | 10.1109/IITC.2001.930081 |