Conference
Interfacial adhesion of copper-low k interconnects
| Τίτλος: | Interfacial adhesion of copper-low k interconnects |
|---|---|
| Συγγραφείς: | Andideh, E., Scherban, T., Sun, B., Blaine, J., Block, C., Jin, B. |
| Πηγή: | Proceedings of the IEEE 2001 International Interconnect Technology Conference (Cat. No.01EX461) Interconnect technology conference Interconnect Technology Conference, 2001. Proceedings of the IEEE 2001 International. :257-259 2001 |
| Relation: | Proceedings of the IEEE 2001 International Interconnect Technology Conference |
| Βάση Δεδομένων: | IEEE Xplore Digital Library |
| FullText | Text: Availability: 0 |
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| Header | DbId: edseee DbLabel: IEEE Xplore Digital Library An: edseee.930077 RelevancyScore: 937 AccessLevel: 2 PubType: Conference PubTypeId: conference PreciseRelevancyScore: 936.854309082031 |
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| Items | – Name: Title Label: Title Group: Ti Data: Interfacial adhesion of copper-low k interconnects – Name: Author Label: Authors Group: Au Data: <searchLink fieldCode="AR" term="%22Andideh%2C+E%2E%22">Andideh, E.</searchLink><br /><searchLink fieldCode="AR" term="%22Scherban%2C+T%2E%22">Scherban, T.</searchLink><br /><searchLink fieldCode="AR" term="%22Sun%2C+B%2E%22">Sun, B.</searchLink><br /><searchLink fieldCode="AR" term="%22Blaine%2C+J%2E%22">Blaine, J.</searchLink><br /><searchLink fieldCode="AR" term="%22Block%2C+C%2E%22">Block, C.</searchLink><br /><searchLink fieldCode="AR" term="%22Jin%2C+B%2E%22">Jin, B.</searchLink> – Name: TitleSource Label: Source Group: Src Data: Proceedings of the IEEE 2001 International Interconnect Technology Conference (Cat. No.01EX461) Interconnect technology conference Interconnect Technology Conference, 2001. Proceedings of the IEEE 2001 International. :257-259 2001 – Name: NoteTitleSource Label: Relation Group: SrcInfo Data: Proceedings of the IEEE 2001 International Interconnect Technology Conference |
| PLink | https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=edseee&AN=edseee.930077 |
| RecordInfo | BibRecord: BibEntity: Identifiers: – Type: doi Value: 10.1109/IITC.2001.930077 PhysicalDescription: Pagination: PageCount: 3 StartPage: 257 Titles: – TitleFull: Interfacial adhesion of copper-low k interconnects Type: main BibRelationships: HasContributorRelationships: – PersonEntity: Name: NameFull: Andideh, E. – PersonEntity: Name: NameFull: Scherban, T. – PersonEntity: Name: NameFull: Sun, B. – PersonEntity: Name: NameFull: Blaine, J. – PersonEntity: Name: NameFull: Block, C. – PersonEntity: Name: NameFull: Jin, B. IsPartOfRelationships: – BibEntity: Dates: – D: 01 M: 01 Type: published Y: 2001 Identifiers: – Type: isbn-print Value: 0780366786 – Type: isbn-print Value: 9780780366787 – Type: issn-locals Value: edseee.IEEEConferenc Titles: – TitleFull: Proceedings of the IEEE 2001 International Interconnect Technology Conference (Cat. No.01EX461), Interconnect Technology Conference, 2001. Proceedings of the IEEE 2001 International, Interconnect technology conference Type: main |
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