Andideh, E., Scherban, T., Sun, B., Blaine, J., Block, C., & Jin, B. (2001). Interfacial adhesion of copper-low k interconnects. Proceedings of the IEEE 2001 International Interconnect Technology Conference (Cat. No.01EX461), Interconnect Technology Conference, 2001. Proceedings of the IEEE 2001 International, Interconnect technology conference, 257. https://doi.org/10.1109/IITC.2001.930077
Παραπομπή σε μορφή Chicago (17η εκδ.)Andideh, E., T. Scherban, B. Sun, J. Blaine, C. Block, και B. Jin. "Interfacial Adhesion of Copper-low K Interconnects." Proceedings of the IEEE 2001 International Interconnect Technology Conference (Cat. No.01EX461), Interconnect Technology Conference, 2001. Proceedings of the IEEE 2001 International, Interconnect Technology Conference 2001: 257. https://doi.org/10.1109/IITC.2001.930077.
Παραπομπή σε μορφή MLA (9th εκδ.)Andideh, E., et al. "Interfacial Adhesion of Copper-low K Interconnects." Proceedings of the IEEE 2001 International Interconnect Technology Conference (Cat. No.01EX461), Interconnect Technology Conference, 2001. Proceedings of the IEEE 2001 International, Interconnect Technology Conference, 2001, p. 257, https://doi.org/10.1109/IITC.2001.930077.