Conference

Ultrathin CVD barrier/seed for 0.1 /spl mu/m dual damascene Cu interconnects

Bibliographic Details
Title: Ultrathin CVD barrier/seed for 0.1 /spl mu/m dual damascene Cu interconnects
Authors: Block, C., McGregor, P., Kuhn, M., Drosd, C.
Source: Proceedings of the IEEE 2001 International Interconnect Technology Conference (Cat. No.01EX461) Interconnect technology conference Interconnect Technology Conference, 2001. Proceedings of the IEEE 2001 International. :210-212 2001
Relation: Proceedings of the IEEE 2001 International Interconnect Technology Conference
Database: IEEE Xplore Digital Library
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