APA (7th ed.) Citation

Block, C., McGregor, P., Kuhn, M., & Drosd, C. (2001). Ultrathin CVD barrier/seed for 0.1 /spl mu/m dual damascene Cu interconnects. Proceedings of the IEEE 2001 International Interconnect Technology Conference (Cat. No.01EX461), Interconnect Technology Conference, 2001. Proceedings of the IEEE 2001 International, Interconnect technology conference, 210. https://doi.org/10.1109/IITC.2001.930063

Chicago Style (17th ed.) Citation

Block, C., P. McGregor, M. Kuhn, and C. Drosd. "Ultrathin CVD Barrier/seed for 0.1 /spl Mu/m Dual Damascene Cu Interconnects." Proceedings of the IEEE 2001 International Interconnect Technology Conference (Cat. No.01EX461), Interconnect Technology Conference, 2001. Proceedings of the IEEE 2001 International, Interconnect Technology Conference 2001: 210. https://doi.org/10.1109/IITC.2001.930063.

MLA (9th ed.) Citation

Block, C., et al. "Ultrathin CVD Barrier/seed for 0.1 /spl Mu/m Dual Damascene Cu Interconnects." Proceedings of the IEEE 2001 International Interconnect Technology Conference (Cat. No.01EX461), Interconnect Technology Conference, 2001. Proceedings of the IEEE 2001 International, Interconnect Technology Conference, 2001, p. 210, https://doi.org/10.1109/IITC.2001.930063.