Conference
Application of Dual-Side Silver Sintering Technology in 6-Inch IGCT Devices
| Τίτλος: | Application of Dual-Side Silver Sintering Technology in 6-Inch IGCT Devices |
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| Συγγραφείς: | Zhang, Hao, Qiao, Qiao, Wang, Liang, Wang, Jingfei, Tian, Yanzhong, Wei, Xiaoguang, Tang, Xinling, Wu, Jinpeng |
| Πηγή: | 2026 27th International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2026 27th International Conference on. :1-7 Aug, 2026 |
| Relation: | 2026 27th International Conference on Electronic Packaging Technology (ICEPT) |
| Βάση Δεδομένων: | IEEE Xplore Digital Library |
| ISBN: | 9798319531117 9798319531124 |
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| ISSN: | 28369734 |
| DOI: | 10.1109/ICEPT71373.2026.11690407 |