Conference
Superb sinterability of the Cu paste consisting of Cu micro-nano particles synthesized by a mild one-pot aqueous method for low-temperature in-air die attachment
| Τίτλος: | Superb sinterability of the Cu paste consisting of Cu micro-nano particles synthesized by a mild one-pot aqueous method for low-temperature in-air die attachment |
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| Συγγραφείς: | Hou, Bin, Qin, Jian-Yun, Zong, Hao-Ze, Zhou, Min-Bo, Zhang, Xin-Ping |
| Πηγή: | 2026 27th International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2026 27th International Conference on. :1-5 Aug, 2026 |
| Relation: | 2026 27th International Conference on Electronic Packaging Technology (ICEPT) |
| Βάση Δεδομένων: | IEEE Xplore Digital Library |
| ISBN: | 9798319531117 9798319531124 |
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| ISSN: | 28369734 |
| DOI: | 10.1109/ICEPT71373.2026.11690204 |