Conference
Dual-scale Modeling of Microwave Remote Plasma System for Enhancing Photoresist Stripping Uniformity in Large-Area Packaging with High-Aspect-Ratio Vias
| Τίτλος: | Dual-scale Modeling of Microwave Remote Plasma System for Enhancing Photoresist Stripping Uniformity in Large-Area Packaging with High-Aspect-Ratio Vias |
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| Συγγραφείς: | Xian, Jian-Wei, Li, Hai-Ping, Zhu, Yang-Lei, Ma, Xiao, Zhang, Xin-Ping |
| Πηγή: | 2026 27th International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2026 27th International Conference on. :1-6 Aug, 2026 |
| Relation: | 2026 27th International Conference on Electronic Packaging Technology (ICEPT) |
| Βάση Δεδομένων: | IEEE Xplore Digital Library |
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