Dual-scale Modeling of Microwave Remote Plasma System for Enhancing Photoresist Stripping Uniformity in Large-Area Packaging with High-Aspect-Ratio Vias

Λεπτομέρειες βιβλιογραφικής εγγραφής
Τίτλος:	Dual-scale Modeling of Microwave Remote Plasma System for Enhancing Photoresist Stripping Uniformity in Large-Area Packaging with High-Aspect-Ratio Vias
Συγγραφείς:	Xian, Jian-Wei, Li, Hai-Ping, Zhu, Yang-Lei, Ma, Xiao, Zhang, Xin-Ping
Πηγή:	2026 27th International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2026 27th International Conference on. :1-6 Aug, 2026
Relation:	2026 27th International Conference on Electronic Packaging Technology (ICEPT)
Βάση Δεδομένων:	IEEE Xplore Digital Library