Simulation Study and Experimental Validation for Optimization of Gas Distribution Plate Structure and Improvement of Plasma Photoresist Stripping in Fan-out Panel-level Packaging (FOPLP)

Λεπτομέρειες βιβλιογραφικής εγγραφής
Τίτλος:	Simulation Study and Experimental Validation for Optimization of Gas Distribution Plate Structure and Improvement of Plasma Photoresist Stripping in Fan-out Panel-level Packaging (FOPLP)
Συγγραφείς:	Zhu, Yang-Lei, Li, Hai-Ping, Xian, Jian-Wei, Ma, Xiao, Zhang, Xin-Ping
Πηγή:	2026 27th International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2026 27th International Conference on. :1-6 Aug, 2026
Relation:	2026 27th International Conference on Electronic Packaging Technology (ICEPT)
Βάση Δεδομένων:	IEEE Xplore Digital Library