Conference
Precise Failure Localization of Integrated Circuits Based on Combined Analysis of EMMI, Mechanical Grinding, and FIB
| Τίτλος: | Precise Failure Localization of Integrated Circuits Based on Combined Analysis of EMMI, Mechanical Grinding, and FIB |
|---|---|
| Συγγραφείς: | Sun, Zhe, Tao, Renxian, Liu, Tianhan |
| Πηγή: | 2026 27th International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2026 27th International Conference on. :1-4 Aug, 2026 |
| Relation: | 2026 27th International Conference on Electronic Packaging Technology (ICEPT) |
| Βάση Δεδομένων: | IEEE Xplore Digital Library |
καταχωρήστε σχόλιο πρώτοι!