High-Uniformity Large-Area Photoresist Removal Based on Optimization of Inductively Coupled Plasma (ICP) Source Architecture for Advanced Fan-out Panel-Level Packaging

Λεπτομέρειες βιβλιογραφικής εγγραφής
Τίτλος:	High-Uniformity Large-Area Photoresist Removal Based on Optimization of Inductively Coupled Plasma (ICP) Source Architecture for Advanced Fan-out Panel-Level Packaging
Συγγραφείς:	Li, Hai-Ping, Xian, Jian-Wei, Zhu, Yang-Lei, Ma, Xiao, Zhang, Xin-Ping
Πηγή:	2026 27th International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2026 27th International Conference on. :1-6 Aug, 2026
Relation:	2026 27th International Conference on Electronic Packaging Technology (ICEPT)
Βάση Δεδομένων:	IEEE Xplore Digital Library