Klein, S., Abraham, A., Huettis, A., Rawlings, T., Erike, E., Schichtel, J., . . . Raghavan, P. (2026). AI Head-Node Socket Interconnect Yield, Warpage, and Functionality. 2026 IEEE 76th Electronic Components and Technology Conference (ECTC), Electronic Components and Technology Conference (ECTC), 2026 IEEE 76th, ECTC, 1661. https://doi.org/10.1109/ECTC51846.2026.00272
Παραπομπή σε μορφή Chicago (17η εκδ.)Klein, Steven, et al. "AI Head-Node Socket Interconnect Yield, Warpage, and Functionality." 2026 IEEE 76th Electronic Components and Technology Conference (ECTC), Electronic Components and Technology Conference (ECTC), 2026 IEEE 76th, ECTC 2026: 1661. https://doi.org/10.1109/ECTC51846.2026.00272.
Παραπομπή σε μορφή MLA (9th εκδ.)Klein, Steven, et al. "AI Head-Node Socket Interconnect Yield, Warpage, and Functionality." 2026 IEEE 76th Electronic Components and Technology Conference (ECTC), Electronic Components and Technology Conference (ECTC), 2026 IEEE 76th, ECTC, 2026, p. 1661, https://doi.org/10.1109/ECTC51846.2026.00272.