Conference
AI Head-Node Socket Interconnect Yield, Warpage, and Functionality
| Τίτλος: | AI Head-Node Socket Interconnect Yield, Warpage, and Functionality |
|---|---|
| Συγγραφείς: | Klein, Steven, Abraham, Amit, Huettis, Alexander, Rawlings, Taylor, Erike, Eric, Schichtel, Jacob, Bakare, Sugadh, Aravamudhan, Srinivasa, Ooi, Renn Chan, Raghavan, Prasanna |
| Πηγή: | 2026 IEEE 76th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2026 IEEE 76th. :1661-1665 May, 2026 |
| Relation: | 2026 IEEE 76th Electronic Components and Technology Conference (ECTC) |
| Βάση Δεδομένων: | IEEE Xplore Digital Library |
| ISBN: | 9798331564179 9798331564186 |
|---|---|
| ISSN: | 23775726 05695503 |
| DOI: | 10.1109/ECTC51846.2026.00272 |