Conference
Material Property Prediction of Bi-doped SnAgCu Solders under High Strain Rates of Mechanical Shock and Vibration
| Τίτλος: | Material Property Prediction of Bi-doped SnAgCu Solders under High Strain Rates of Mechanical Shock and Vibration |
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| Συγγραφείς: | Lall, Pradeep, Mehta, Vishal, Suhling, Jeff, Locker, David |
| Πηγή: | 2026 27th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2026 27th International Conference on. :1-8 Apr, 2026 |
| Relation: | 2026 27th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) |
| Βάση Δεδομένων: | IEEE Xplore Digital Library |
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