Conference
Material Property Prediction of Bi-doped SnAgCu Solders under High Strain Rates of Mechanical Shock and Vibration
| Τίτλος: | Material Property Prediction of Bi-doped SnAgCu Solders under High Strain Rates of Mechanical Shock and Vibration |
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| Συγγραφείς: | Lall, Pradeep, Mehta, Vishal, Suhling, Jeff, Locker, David |
| Πηγή: | 2026 27th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2026 27th International Conference on. :1-8 Apr, 2026 |
| Relation: | 2026 27th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) |
| Βάση Δεδομένων: | IEEE Xplore Digital Library |
| ISBN: | 9798331562496 9798331562502 |
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| ISSN: | 28338596 28338553 |
| DOI: | 10.1109/EuroSimE69483.2026.11511964 |