APA (7th ed.) Citation

Lall, P., Mehta, V., Suhling, J., & Locker, D. (2026). Material Property Prediction of Bi-doped SnAgCu Solders under High Strain Rates of Mechanical Shock and Vibration. 2026 27th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2026 27th International Conference on, 1. https://doi.org/10.1109/EuroSimE69483.2026.11511964

Chicago Style (17th ed.) Citation

Lall, Pradeep, Vishal Mehta, Jeff Suhling, and David Locker. "Material Property Prediction of Bi-doped SnAgCu Solders Under High Strain Rates of Mechanical Shock and Vibration." 2026 27th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2026 27th International Conference on 2026: 1. https://doi.org/10.1109/EuroSimE69483.2026.11511964.

MLA (9th ed.) Citation

Lall, Pradeep, et al. "Material Property Prediction of Bi-doped SnAgCu Solders Under High Strain Rates of Mechanical Shock and Vibration." 2026 27th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2026 27th International Conference on, 2026, p. 1, https://doi.org/10.1109/EuroSimE69483.2026.11511964.