Conference
Design Tradeoffs of Through-Silicon-Carbide Vias for High-Temperature 3D SiC IC Integration
| Τίτλος: | Design Tradeoffs of Through-Silicon-Carbide Vias for High-Temperature 3D SiC IC Integration |
|---|---|
| Συγγραφείς: | Thota, Sahithi, Song, Li, Li, Feng |
| Πηγή: | 2026 IEEE Workshop on Microelectronics and Electron Devices (WMED) Microelectronics and Electron Devices (WMED), 2026 IEEE Workshop on. :10-13 Apr, 2026 |
| Relation: | 2026 IEEE Workshop on Microelectronics and Electron Devices (WMED) |
| Βάση Δεδομένων: | IEEE Xplore Digital Library |
καταχωρήστε σχόλιο πρώτοι!