Conference
Design Tradeoffs of Through-Silicon-Carbide Vias for High-Temperature 3D SiC IC Integration
| Τίτλος: | Design Tradeoffs of Through-Silicon-Carbide Vias for High-Temperature 3D SiC IC Integration |
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| Συγγραφείς: | Thota, Sahithi, Song, Li, Li, Feng |
| Πηγή: | 2026 IEEE Workshop on Microelectronics and Electron Devices (WMED) Microelectronics and Electron Devices (WMED), 2026 IEEE Workshop on. :10-13 Apr, 2026 |
| Relation: | 2026 IEEE Workshop on Microelectronics and Electron Devices (WMED) |
| Βάση Δεδομένων: | IEEE Xplore Digital Library |
| ISBN: | 9798319520593 9798319520609 |
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| ISSN: | 19473842 19473834 |
| DOI: | 10.1109/WMED71264.2026.11509675 |