Academic Journal
Dual EMAT–MIEC Testing Method for High-Speed Surface and Backside Defect Inspection
| Τίτλος: | Dual EMAT–MIEC Testing Method for High-Speed Surface and Backside Defect Inspection |
|---|---|
| Συγγραφείς: | Xiao, Y., Feng, B., Guo, Y., Wang, K., Song, Y., Wang, Z., Kang, Y. |
| Πηγή: | IEEE Transactions on Instrumentation and Measurement IEEE Trans. Instrum. Meas. Instrumentation and Measurement, IEEE Transactions on. 75:1-9 2026 |
| Βάση Δεδομένων: | IEEE Xplore Digital Library |
| FullText | Text: Availability: 0 CustomLinks: – Url: https://resolver.ebsco.com/c/fiv2js/result?sid=EBSCO:edseee&genre=article&issn=00189456&ISBN=&volume=75&issue=&date=20260101&spage=1&pages=1-9&title=IEEE Transactions on Instrumentation and Measurement, Instrumentation and Measurement, IEEE Transactions on, IEEE Trans. Instrum. Meas.&atitle=Dual%20EMAT%E2%80%93MIEC%20Testing%20Method%20for%20High-Speed%20Surface%20and%20Backside%20Defect%20Inspection&aulast=Xiao%2C%20Y.&id=DOI:10.1109/TIM.2026.3674241 Name: Full Text Finder (for New FTF UI) (ns324271) Category: fullText Text: Full Text Finder MouseOverText: Full Text Finder |
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| Header | DbId: edseee DbLabel: IEEE Xplore Digital Library An: edseee.11435176 RelevancyScore: 1116 AccessLevel: 2 PubType: Academic Journal PubTypeId: academicJournal PreciseRelevancyScore: 1115.63562011719 |
| IllustrationInfo | |
| Items | – Name: Title Label: Title Group: Ti Data: Dual EMAT–MIEC Testing Method for High-Speed Surface and Backside Defect Inspection – Name: Author Label: Authors Group: Au Data: <searchLink fieldCode="AR" term="%22Xiao%2C+Y%2E%22">Xiao, Y.</searchLink><br /><searchLink fieldCode="AR" term="%22Feng%2C+B%2E%22">Feng, B.</searchLink><br /><searchLink fieldCode="AR" term="%22Guo%2C+Y%2E%22">Guo, Y.</searchLink><br /><searchLink fieldCode="AR" term="%22Wang%2C+K%2E%22">Wang, K.</searchLink><br /><searchLink fieldCode="AR" term="%22Song%2C+Y%2E%22">Song, Y.</searchLink><br /><searchLink fieldCode="AR" term="%22Wang%2C+Z%2E%22">Wang, Z.</searchLink><br /><searchLink fieldCode="AR" term="%22Kang%2C+Y%2E%22">Kang, Y.</searchLink> – Name: TitleSource Label: Source Group: Src Data: IEEE Transactions on Instrumentation and Measurement IEEE Trans. Instrum. Meas. Instrumentation and Measurement, IEEE Transactions on. 75:1-9 2026 |
| PLink | https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=edseee&AN=edseee.11435176 |
| RecordInfo | BibRecord: BibEntity: Identifiers: – Type: doi Value: 10.1109/TIM.2026.3674241 PhysicalDescription: Pagination: PageCount: 9 StartPage: 1 Titles: – TitleFull: Dual EMAT–MIEC Testing Method for High-Speed Surface and Backside Defect Inspection Type: main BibRelationships: HasContributorRelationships: – PersonEntity: Name: NameFull: Xiao, Y. – PersonEntity: Name: NameFull: Feng, B. – PersonEntity: Name: NameFull: Guo, Y. – PersonEntity: Name: NameFull: Wang, K. – PersonEntity: Name: NameFull: Song, Y. – PersonEntity: Name: NameFull: Wang, Z. – PersonEntity: Name: NameFull: Kang, Y. IsPartOfRelationships: – BibEntity: Dates: – D: 01 M: 01 Type: published Y: 2026 Identifiers: – Type: issn-print Value: 00189456 – Type: issn-print Value: 15579662 – Type: issn-locals Value: edseee.IEEEJournals Numbering: – Type: volume Value: 75 Titles: – TitleFull: IEEE Transactions on Instrumentation and Measurement, Instrumentation and Measurement, IEEE Transactions on, IEEE Trans. Instrum. Meas. Type: main |
| ResultId | 1 |