Xiao, Y., Feng, B., Guo, Y., Wang, K., Song, Y., Wang, Z., & Kang, Y. (2026). Dual EMAT–MIEC Testing Method for High-Speed Surface and Backside Defect Inspection. IEEE Transactions on Instrumentation and Measurement, Instrumentation and Measurement, IEEE Transactions on, IEEE Trans. Instrum. Meas., 75, 1-9. https://doi.org/10.1109/TIM.2026.3674241
Παραπομπή σε μορφή Chicago (17η εκδ.)Xiao, Y., B. Feng, Y. Guo, K. Wang, Y. Song, Z. Wang, και Y. Kang. "Dual EMAT–MIEC Testing Method for High-Speed Surface and Backside Defect Inspection." IEEE Transactions on Instrumentation and Measurement, Instrumentation and Measurement, IEEE Transactions on, IEEE Trans. Instrum. Meas. 75 (2026): 1-9. https://doi.org/10.1109/TIM.2026.3674241.
Παραπομπή σε μορφή MLA (9th εκδ.)Xiao, Y., et al. "Dual EMAT–MIEC Testing Method for High-Speed Surface and Backside Defect Inspection." IEEE Transactions on Instrumentation and Measurement, Instrumentation and Measurement, IEEE Transactions on, IEEE Trans. Instrum. Meas., vol. 75, 2026, pp. 1-9, https://doi.org/10.1109/TIM.2026.3674241.