Conference
Study on Surface Damage of 12-Inch Silicon Carbide Wafers During Diamond Wire Cutting
| Τίτλος: | Study on Surface Damage of 12-Inch Silicon Carbide Wafers During Diamond Wire Cutting |
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| Συγγραφείς: | Li, Qingyu, Yang, Yong, Yu, Wancheng, Chen, Xiufang, Yang, Xianglong, Xie, Xuejian, Wang, Rongkun, Zhong, Guanglei, Xu, Xiangang |
| Πηγή: | 2025 22nd China International Forum on Solid State Lighting & 2025 11th International Forum on Wide Bandgap Semiconductors (SSLCHINA: IFWS) Solid State Lighting & 2025 11th International Forum on Wide Bandgap Semiconductors (SSLCHINA: IFWS), 2025 22nd China International Forum on. :1-4 Nov, 2025 |
| Relation: | 2025 22nd China International Forum on Solid State Lighting & 2025 11th International Forum on Wide Bandgap Semiconductors (SSLCHINA: IFWS) |
| Βάση Δεδομένων: | IEEE Xplore Digital Library |
| ISBN: | 9798331558666 9798331558673 |
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| DOI: | 10.1109/SSLCHINAIFWS69008.2025.11314877 |