Academic Journal
Virtual Dissection of Void in Solder Joints and the Impact of RDS(on) on the Reliability Performance of SiC Power MOSFETs
| Τίτλος: | Virtual Dissection of Void in Solder Joints and the Impact of RDS(on) on the Reliability Performance of SiC Power MOSFETs |
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| Συγγραφείς: | Noorasid, N.S., Kamarolzaman, A.A., Abidin, M.Z.B.Z., Razali, N., Sukiman, M.S., Krishnan, S., Omar, G., Arith, F. |
| Πηγή: | IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manuf. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 16(6):1341-1348 Jun, 2026 |
| Βάση Δεδομένων: | IEEE Xplore Digital Library |
| ISSN: | 21563950 21563985 |
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| DOI: | 10.1109/TCPMT.2025.3634597 |