Lee, C., Vaitheeswaran, P., Subbarayan, G., Park, Y., Chung, J., & Krishnan, S. (2026). The Impact of Large-Amplitude Intermittent Current Pulsing on the Reliability of Die Metal–Dielectric Structures. IEEE Transactions on Components, Packaging and Manufacturing Technology, Components, Packaging and Manufacturing Technology, IEEE Transactions on, IEEE Trans. Compon., Packag. Manuf. Technol., 16(4), 801. https://doi.org/10.1109/TCPMT.2025.3630547
Παραπομπή σε μορφή Chicago (17η εκδ.)Lee, C., P.K Vaitheeswaran, G. Subbarayan, Y. Park, J. Chung, και S. Krishnan. "The Impact of Large-Amplitude Intermittent Current Pulsing on the Reliability of Die Metal–Dielectric Structures." IEEE Transactions on Components, Packaging and Manufacturing Technology, Components, Packaging and Manufacturing Technology, IEEE Transactions on, IEEE Trans. Compon., Packag. Manuf. Technol. 16, no. 4 (2026): 801. https://doi.org/10.1109/TCPMT.2025.3630547.
Παραπομπή σε μορφή MLA (9th εκδ.)Lee, C., et al. "The Impact of Large-Amplitude Intermittent Current Pulsing on the Reliability of Die Metal–Dielectric Structures." IEEE Transactions on Components, Packaging and Manufacturing Technology, Components, Packaging and Manufacturing Technology, IEEE Transactions on, IEEE Trans. Compon., Packag. Manuf. Technol., vol. 16, no. 4, 2026, p. 801, https://doi.org/10.1109/TCPMT.2025.3630547.