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Thermal-Resistance-Based Reliability of TIM1 Materials in a Lidded Thermal Test Vehicle Under Active Thermal Load-Cycling

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Τίτλος: Thermal-Resistance-Based Reliability of TIM1 Materials in a Lidded Thermal Test Vehicle Under Active Thermal Load-Cycling
Συγγραφείς: Sternberg, Maik, May, Daniel, Wargulski, Dan R., Pareek, Kaushal Arun, Wunderle, Bernhard, Ras, Mohamad Abo
Πηγή: 2025 31st International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) Thermal Investigations of ICs and Systems (THERMINIC), 2025 31st International Workshop on. :1-6 Sep, 2025
Relation: 2025 31st International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)
Βάση Δεδομένων: IEEE Xplore Digital Library
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Header DbId: edseee
DbLabel: IEEE Xplore Digital Library
An: edseee.11216935
RelevancyScore: 1117
AccessLevel: 2
PubType: Conference
PubTypeId: conference
PreciseRelevancyScore: 1116.81677246094
IllustrationInfo
Items – Name: Title
  Label: Title
  Group: Ti
  Data: Thermal-Resistance-Based Reliability of TIM1 Materials in a Lidded Thermal Test Vehicle Under Active Thermal Load-Cycling
– Name: Author
  Label: Authors
  Group: Au
  Data: <searchLink fieldCode="AR" term="%22Sternberg%2C+Maik%22">Sternberg, Maik</searchLink><br /><searchLink fieldCode="AR" term="%22May%2C+Daniel%22">May, Daniel</searchLink><br /><searchLink fieldCode="AR" term="%22Wargulski%2C+Dan+R%2E%22">Wargulski, Dan R.</searchLink><br /><searchLink fieldCode="AR" term="%22Pareek%2C+Kaushal+Arun%22">Pareek, Kaushal Arun</searchLink><br /><searchLink fieldCode="AR" term="%22Wunderle%2C+Bernhard%22">Wunderle, Bernhard</searchLink><br /><searchLink fieldCode="AR" term="%22Ras%2C+Mohamad+Abo%22">Ras, Mohamad Abo</searchLink>
– Name: TitleSource
  Label: Source
  Group: Src
  Data: 2025 31st International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) Thermal Investigations of ICs and Systems (THERMINIC), 2025 31st International Workshop on. :1-6 Sep, 2025
– Name: NoteTitleSource
  Label: Relation
  Group: SrcInfo
  Data: 2025 31st International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)
PLink https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=edseee&AN=edseee.11216935
RecordInfo BibRecord:
  BibEntity:
    Identifiers:
      – Type: doi
        Value: 10.1109/THERMINIC65879.2025.11216935
    PhysicalDescription:
      Pagination:
        PageCount: 6
        StartPage: 1
    Titles:
      – TitleFull: Thermal-Resistance-Based Reliability of TIM1 Materials in a Lidded Thermal Test Vehicle Under Active Thermal Load-Cycling
        Type: main
  BibRelationships:
    HasContributorRelationships:
      – PersonEntity:
          Name:
            NameFull: Sternberg, Maik
      – PersonEntity:
          Name:
            NameFull: May, Daniel
      – PersonEntity:
          Name:
            NameFull: Wargulski, Dan R.
      – PersonEntity:
          Name:
            NameFull: Pareek, Kaushal Arun
      – PersonEntity:
          Name:
            NameFull: Wunderle, Bernhard
      – PersonEntity:
          Name:
            NameFull: Ras, Mohamad Abo
    IsPartOfRelationships:
      – BibEntity:
          Dates:
            – D: 24
              M: 09
              Type: published
              Y: 2025
          Identifiers:
            – Type: isbn-print
              Value: 9798331594862
            – Type: issn-print
              Value: 24741523
            – Type: issn-locals
              Value: edseee.IEEEConferenc
          Titles:
            – TitleFull: 2025 31st International Workshop on Thermal Investigations of ICs and Systems (THERMINIC), Thermal Investigations of ICs and Systems (THERMINIC), 2025 31st International Workshop on
              Type: main
ResultId 1