Λεπτομέρειες βιβλιογραφικής εγγραφής
| Τίτλος: |
Thermal-Resistance-Based Reliability of TIM1 Materials in a Lidded Thermal Test Vehicle Under Active Thermal Load-Cycling |
| Συγγραφείς: |
Sternberg, Maik, May, Daniel, Wargulski, Dan R., Pareek, Kaushal Arun, Wunderle, Bernhard, Ras, Mohamad Abo |
| Πηγή: |
2025 31st International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) Thermal Investigations of ICs and Systems (THERMINIC), 2025 31st International Workshop on. :1-6 Sep, 2025 |
| Relation: |
2025 31st International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) |
| Βάση Δεδομένων: |
IEEE Xplore Digital Library |