Sternberg, M., May, D., Wargulski, D. R., Pareek, K. A., Wunderle, B., & Ras, M. A. (2025). Thermal-Resistance-Based Reliability of TIM1 Materials in a Lidded Thermal Test Vehicle Under Active Thermal Load-Cycling. 2025 31st International Workshop on Thermal Investigations of ICs and Systems (THERMINIC), Thermal Investigations of ICs and Systems (THERMINIC), 2025 31st International Workshop on, 1. https://doi.org/10.1109/THERMINIC65879.2025.11216935
Παραπομπή σε μορφή Chicago (17η εκδ.)Sternberg, Maik, Daniel May, Dan R. Wargulski, Kaushal Arun Pareek, Bernhard Wunderle, και Mohamad Abo Ras. "Thermal-Resistance-Based Reliability of TIM1 Materials in a Lidded Thermal Test Vehicle Under Active Thermal Load-Cycling." 2025 31st International Workshop on Thermal Investigations of ICs and Systems (THERMINIC), Thermal Investigations of ICs and Systems (THERMINIC), 2025 31st International Workshop on 2025: 1. https://doi.org/10.1109/THERMINIC65879.2025.11216935.
Παραπομπή σε μορφή MLA (9th εκδ.)Sternberg, Maik, et al. "Thermal-Resistance-Based Reliability of TIM1 Materials in a Lidded Thermal Test Vehicle Under Active Thermal Load-Cycling." 2025 31st International Workshop on Thermal Investigations of ICs and Systems (THERMINIC), Thermal Investigations of ICs and Systems (THERMINIC), 2025 31st International Workshop on, 2025, p. 1, https://doi.org/10.1109/THERMINIC65879.2025.11216935.