Conference
Design of Data Processing Microsystem Packages Based on High Temperature Co-Fired Ceramics
| Τίτλος: | Design of Data Processing Microsystem Packages Based on High Temperature Co-Fired Ceramics |
|---|---|
| Συγγραφείς: | Duan, Qiang, Liu, Yao-yao, Yang, Zhen-tao, Liu, Yang, Liu, Lin-jie |
| Πηγή: | 2024 25th International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2024 25th International Conference on. :1-3 Aug, 2024 |
| Relation: | 2024 25th International Conference on Electronic Packaging Technology (ICEPT) |
| Βάση Δεδομένων: | IEEE Xplore Digital Library |
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