Λεπτομέρειες βιβλιογραφικής εγγραφής
| Τίτλος: |
Design of Data Processing Microsystem Packages Based on High Temperature Co-Fired Ceramics |
| Συγγραφείς: |
Duan, Qiang, Liu, Yao-yao, Yang, Zhen-tao, Liu, Yang, Liu, Lin-jie |
| Πηγή: |
2024 25th International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2024 25th International Conference on. :1-3 Aug, 2024 |
| Relation: |
2024 25th International Conference on Electronic Packaging Technology (ICEPT) |
| Βάση Δεδομένων: |
IEEE Xplore Digital Library |