APA (7th ed.) Citation

Duan, Q., Liu, Y., Yang, Z., Liu, Y., & Liu, L. (2024). Design of Data Processing Microsystem Packages Based on High Temperature Co-Fired Ceramics. 2024 25th International Conference on Electronic Packaging Technology (ICEPT), Electronic Packaging Technology (ICEPT), 2024 25th International Conference on, 1. https://doi.org/10.1109/ICEPT63120.2024.10668784

Chicago Style (17th ed.) Citation

Duan, Qiang, Yao-yao Liu, Zhen-tao Yang, Yang Liu, and Lin-jie Liu. "Design of Data Processing Microsystem Packages Based on High Temperature Co-Fired Ceramics." 2024 25th International Conference on Electronic Packaging Technology (ICEPT), Electronic Packaging Technology (ICEPT), 2024 25th International Conference on 2024: 1. https://doi.org/10.1109/ICEPT63120.2024.10668784.

MLA (9th ed.) Citation

Duan, Qiang, et al. "Design of Data Processing Microsystem Packages Based on High Temperature Co-Fired Ceramics." 2024 25th International Conference on Electronic Packaging Technology (ICEPT), Electronic Packaging Technology (ICEPT), 2024 25th International Conference on, 2024, p. 1, https://doi.org/10.1109/ICEPT63120.2024.10668784.