Conference
Ultra-thin Double Side SiP Technology with Embedded Trace Substrate
| Τίτλος: | Ultra-thin Double Side SiP Technology with Embedded Trace Substrate |
|---|---|
| Συγγραφείς: | Li, Jerry Che-Han, Belonio, Jesus Mennen, Tang, Humi Shih-Wen, Wei, Jessie Yu-Shan |
| Πηγή: | 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :1277-1281 May, 2024 |
| Relation: | 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) |
| Βάση Δεδομένων: | IEEE Xplore Digital Library |
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