Conference
Characterization and simulation of delamination on package-level considering sub-critical interfacial fracture-parameters under cyclic loading.
| Τίτλος: | Characterization and simulation of delamination on package-level considering sub-critical interfacial fracture-parameters under cyclic loading. |
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| Συγγραφείς: | Kniely, R., Heilmann, J., Huber, F., Wunderle, B. |
| Πηγή: | 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2023 24th International Conference on. :1-11 Apr, 2023 |
| Relation: | 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) |
| Βάση Δεδομένων: | IEEE Xplore Digital Library |
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