Λεπτομέρειες βιβλιογραφικής εγγραφής
| Τίτλος: |
Characterization and simulation of delamination on package-level considering sub-critical interfacial fracture-parameters under cyclic loading. |
| Συγγραφείς: |
Kniely, R., Heilmann, J., Huber, F., Wunderle, B. |
| Πηγή: |
2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2023 24th International Conference on. :1-11 Apr, 2023 |
| Relation: |
2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) |
| Βάση Δεδομένων: |
IEEE Xplore Digital Library |