Λεπτομέρειες βιβλιογραφικής εγγραφής
| Τίτλος: |
Effect of Sintering Temperature on Copper Metallization of 3D-Printed Alumina |
| Συγγραφείς: |
Laureen Ida M. Ballesteros, Key T. Simfroso, Ray Noel M. Delda, Gina A. Catalan, Denise Daryl A. Florante, Vladimir M. Sarmiento |
| Πηγή: |
Materials Science Forum. 1179:45-51 |
| Στοιχεία εκδότη: |
Trans Tech Publications, Ltd., 2026. |
| Έτος έκδοσης: |
2026 |
| Περιγραφή: |
Alumina (Al 2 O 3 ) is a technical ceramic widely selected for demanding applications due to its excellent material properties, such as high strength, corrosion resistance, and thermal stability. In this study, the effect of the sintering temperature of 3D-printed alumina to its surface characteristics and its subsequent performance as a copper-metallized ceramic substrate was investigated. Green parts of alumina samples were prepared using stereolithography (SLA) 3D printing, debound, then sintered at temperatures ranging from 1660°C to 1740°C. Surface roughness was quantified using Atomic Force Microscopy (AFM), while the copper layer's adhesion was assessed via tape and burnishing tests. Electrical conductivity was measured with a four-point probe. A non-monotonic relationship between sintering temperature and surface roughness was observed. Roughness (Ra) decreased as temperature increased from 1660°C to 1720°C, attributed to enhanced densification. However, increasing the temperature to 1740°C led to grain coarsening and a slight increase in roughness due to excessive grain growth. Stronger copper adhesion was achieved on smoother surfaces produced at optimized sintering temperatures. Electrical conductivity was also determined with a minimum sheet resistance of 0.089 mΩ/sq achieved. |
| Τύπος εγγράφου: |
Article |
| ISSN: |
1662-9752 |
| DOI: |
10.4028/p-aaeyb0 |
| Rights: |
Trans Tech Publications Copyright and Content Usage Policy |
| Αριθμός Καταχώρησης: |
edsair.doi...........494863bb91592921ee6cc0721555e720 |
| Βάση Δεδομένων: |
OpenAIRE |