Academic Journal
Artificial intelligence-assisted reliability assessment in electronics packaging: a brief review
| Τίτλος: | Artificial intelligence-assisted reliability assessment in electronics packaging: a brief review |
|---|---|
| Συγγραφείς: | Dai, YanweiAff1, Aff2, IDs44275026000476_cor1, Qin, FeiAff1, Aff2, Jia, XinyueAff1, Hao, YuqiAff1 |
| Πηγή: | Moore and More. 3(1) |
| Βάση Δεδομένων: | Springer Nature Journals |
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