Academic Journal
Artificial intelligence-assisted reliability assessment in electronics packaging: a brief review
| Title: | Artificial intelligence-assisted reliability assessment in electronics packaging: a brief review |
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| Authors: | Dai, YanweiAff1, Aff2, IDs44275026000476_cor1, Qin, FeiAff1, Aff2, Jia, XinyueAff1, Hao, YuqiAff1 |
| Source: | Moore and More. 3(1) |
| Database: | Springer Nature Journals |
| ISSN: | 2097616X 30048680 |
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| DOI: | 10.1007/s44275-026-00047-6 |