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Artificial intelligence-assisted reliability assessment in electronics packaging: a brief review

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Τίτλος: Artificial intelligence-assisted reliability assessment in electronics packaging: a brief review
Συγγραφείς: Dai, YanweiAff1, Aff2, IDs44275026000476_cor1, Qin, FeiAff1, Aff2, Jia, XinyueAff1, Hao, YuqiAff1
Πηγή: Moore and More. 3(1)
Βάση Δεδομένων: Springer Nature Journals
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  – Url: https://dx.doi.org/doi:10.1007/s44275-026-00047-6
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  Data: <i>Moore and More</i>. 3(1)
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