Παραπομπή σε μορφή APA (7η εκδ.)

Dai, Y., Qin, F., Jia, X., & Hao, Y. (2026). Artificial intelligence-assisted reliability assessment in electronics packaging: A brief review. Moore and More, 3(1), . https://doi.org/10.1007/s44275-026-00047-6

Παραπομπή σε μορφή Chicago (17η εκδ.)

Dai, Yanwei, Fei Qin, Xinyue Jia, και Yuqi Hao. "Artificial Intelligence-assisted Reliability Assessment in Electronics Packaging: A Brief Review." Moore and More 3, no. 1 (2026). https://doi.org/10.1007/s44275-026-00047-6.

Παραπομπή σε μορφή MLA (9th εκδ.)

Dai, Yanwei, et al. "Artificial Intelligence-assisted Reliability Assessment in Electronics Packaging: A Brief Review." Moore and More, vol. 3, no. 1, 2026, https://doi.org/10.1007/s44275-026-00047-6.