Zhong, C., Peng, X., Li, C., Wan, Y., Xue, S., Lu, J., . . . Chang, H. (2022). Construction and Verification of Hyperelastic Constitutive for Polymer Materials. 2022 23rd International Conference on Electronic Packaging Technology (ICEPT), Electronic Packaging Technology (ICEPT), 2022 23rd International Conference on, 1. https://doi.org/10.1109/ICEPT56209.2022.9872564
Παραπομπή σε μορφή Chicago (17η εκδ.)Zhong, Cheng, et al. "Construction and Verification of Hyperelastic Constitutive for Polymer Materials." 2022 23rd International Conference on Electronic Packaging Technology (ICEPT), Electronic Packaging Technology (ICEPT), 2022 23rd International Conference on 2022: 1. https://doi.org/10.1109/ICEPT56209.2022.9872564.
Παραπομπή σε μορφή MLA (9th εκδ.)Zhong, Cheng, et al. "Construction and Verification of Hyperelastic Constitutive for Polymer Materials." 2022 23rd International Conference on Electronic Packaging Technology (ICEPT), Electronic Packaging Technology (ICEPT), 2022 23rd International Conference on, 2022, p. 1, https://doi.org/10.1109/ICEPT56209.2022.9872564.