Conference
Health Monitoring and Feature Vector Identification of Failure for SAC305 Solder PCB’s under Shock Loads up to 10,000g
| Τίτλος: | Health Monitoring and Feature Vector Identification of Failure for SAC305 Solder PCB’s under Shock Loads up to 10,000g |
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| Συγγραφείς: | Lall, Pradeep, Thomas, Tony, Blecker, Ken |
| Πηγή: | 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2020 19th IEEE Intersociety Conference on. :932-944 Jul, 2020 |
| Relation: | 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) |
| Βάση Δεδομένων: | IEEE Xplore Digital Library |
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