Lall, P., Thomas, T., & Blecker, K. (2020). Health Monitoring and Feature Vector Identification of Failure for SAC305 Solder PCB’s under Shock Loads up to 10,000g. 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2020 19th IEEE Intersociety Conference on, 932. https://doi.org/10.1109/ITherm45881.2020.9190946
Παραπομπή σε μορφή Chicago (17η εκδ.)Lall, Pradeep, Tony Thomas, και Ken Blecker. "Health Monitoring and Feature Vector Identification of Failure for SAC305 Solder PCB’s Under Shock Loads Up to 10,000g." 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2020 19th IEEE Intersociety Conference on 2020: 932. https://doi.org/10.1109/ITherm45881.2020.9190946.
Παραπομπή σε μορφή MLA (9th εκδ.)Lall, Pradeep, et al. "Health Monitoring and Feature Vector Identification of Failure for SAC305 Solder PCB’s Under Shock Loads Up to 10,000g." 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2020 19th IEEE Intersociety Conference on, 2020, p. 932, https://doi.org/10.1109/ITherm45881.2020.9190946.