Academic Journal
Validation and Optimization of Calculated Stress Fields in Double-Mold Optoelectronics Sensor Packaging
| Title: | Validation and Optimization of Calculated Stress Fields in Double-Mold Optoelectronics Sensor Packaging |
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| Authors: | Huber, F., Etschmaier, H., Dobs, T., Walter, H., Wittler, O., Hadley, P. |
| Source: | IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 10(6):974-981 Jun, 2020 |
| Database: | IEEE Xplore Digital Library |
| ISSN: | 21563950 21563985 |
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| DOI: | 10.1109/TCPMT.2020.2986714 |