Wang, C., Wang, Y., & Ma, K. (2026). A Surface-Mount Package Based on Metal-Integrated Suspended Line (MISL) Technology. IEEE Transactions on Components, Packaging and Manufacturing Technology, Components, Packaging and Manufacturing Technology, IEEE Transactions on, IEEE Trans. Compon., Packag. Manuf. Technol., 16(10), 2423-2426. https://doi.org/10.1109/TCPMT.2026.3733039
Παραπομπή σε μορφή Chicago (17η εκδ.)Wang, C., Y. Wang, και K. Ma. "A Surface-Mount Package Based on Metal-Integrated Suspended Line (MISL) Technology." IEEE Transactions on Components, Packaging and Manufacturing Technology, Components, Packaging and Manufacturing Technology, IEEE Transactions on, IEEE Trans. Compon., Packag. Manuf. Technol. 16, no. 10 (2026): 2423-2426. https://doi.org/10.1109/TCPMT.2026.3733039.
Παραπομπή σε μορφή MLA (9th εκδ.)Wang, C., et al. "A Surface-Mount Package Based on Metal-Integrated Suspended Line (MISL) Technology." IEEE Transactions on Components, Packaging and Manufacturing Technology, Components, Packaging and Manufacturing Technology, IEEE Transactions on, IEEE Trans. Compon., Packag. Manuf. Technol., vol. 16, no. 10, 2026, pp. 2423-2426, https://doi.org/10.1109/TCPMT.2026.3733039.