Conference
Pressure Cu Sintering Paste Developed for Next Generation Interconnection Material
| Title: | Pressure Cu Sintering Paste Developed for Next Generation Interconnection Material |
|---|---|
| Authors: | Ma, Li, Wu, Yan, Han, Xuelian, Yao, Min, Chen, Fen |
| Source: | 2026 27th International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2026 27th International Conference on. :1-5 Aug, 2026 |
| Relation: | 2026 27th International Conference on Electronic Packaging Technology (ICEPT) |
| Database: | IEEE Xplore Digital Library |
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