Ma, L., Wu, Y., Han, X., Yao, M., & Chen, F. (2026). Pressure Cu Sintering Paste Developed for Next Generation Interconnection Material. 2026 27th International Conference on Electronic Packaging Technology (ICEPT), Electronic Packaging Technology (ICEPT), 2026 27th International Conference on, 1. https://doi.org/10.1109/ICEPT71373.2026.11690367
Παραπομπή σε μορφή Chicago (17η εκδ.)Ma, Li, Yan Wu, Xuelian Han, Min Yao, και Fen Chen. "Pressure Cu Sintering Paste Developed for Next Generation Interconnection Material." 2026 27th International Conference on Electronic Packaging Technology (ICEPT), Electronic Packaging Technology (ICEPT), 2026 27th International Conference on 2026: 1. https://doi.org/10.1109/ICEPT71373.2026.11690367.
Παραπομπή σε μορφή MLA (9th εκδ.)Ma, Li, et al. "Pressure Cu Sintering Paste Developed for Next Generation Interconnection Material." 2026 27th International Conference on Electronic Packaging Technology (ICEPT), Electronic Packaging Technology (ICEPT), 2026 27th International Conference on, 2026, p. 1, https://doi.org/10.1109/ICEPT71373.2026.11690367.