APA (7th ed.) Citation

Ma, L., Wu, Y., Han, X., Yao, M., & Chen, F. (2026). Pressure Cu Sintering Paste Developed for Next Generation Interconnection Material. 2026 27th International Conference on Electronic Packaging Technology (ICEPT), Electronic Packaging Technology (ICEPT), 2026 27th International Conference on, 1. https://doi.org/10.1109/ICEPT71373.2026.11690367

Chicago Style (17th ed.) Citation

Ma, Li, Yan Wu, Xuelian Han, Min Yao, and Fen Chen. "Pressure Cu Sintering Paste Developed for Next Generation Interconnection Material." 2026 27th International Conference on Electronic Packaging Technology (ICEPT), Electronic Packaging Technology (ICEPT), 2026 27th International Conference on 2026: 1. https://doi.org/10.1109/ICEPT71373.2026.11690367.

MLA (9th ed.) Citation

Ma, Li, et al. "Pressure Cu Sintering Paste Developed for Next Generation Interconnection Material." 2026 27th International Conference on Electronic Packaging Technology (ICEPT), Electronic Packaging Technology (ICEPT), 2026 27th International Conference on, 2026, p. 1, https://doi.org/10.1109/ICEPT71373.2026.11690367.