Conference
Physics-Cascaded Deep Learning for Nonlinear Thermo-mechanical Reliability Assessment of Cu TSV Interconnects
| Τίτλος: | Physics-Cascaded Deep Learning for Nonlinear Thermo-mechanical Reliability Assessment of Cu TSV Interconnects |
|---|---|
| Συγγραφείς: | Cao, Liang, Tang, Jiayi, Li, Menghan, Dong, Manqi, Xu, Guanghui, Li, Ming |
| Πηγή: | 2026 27th International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2026 27th International Conference on. :1-5 Aug, 2026 |
| Relation: | 2026 27th International Conference on Electronic Packaging Technology (ICEPT) |
| Βάση Δεδομένων: | IEEE Xplore Digital Library |
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