Conference
Glass Packaging and Its Reliability
| Τίτλος: | Glass Packaging and Its Reliability |
|---|---|
| Συγγραφείς: | Lau, John H. |
| Πηγή: | 2026 27th International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2026 27th International Conference on. :1-9 Aug, 2026 |
| Relation: | 2026 27th International Conference on Electronic Packaging Technology (ICEPT) |
| Βάση Δεδομένων: | IEEE Xplore Digital Library |
| FullText | Text: Availability: 0 |
|---|---|
| Header | DbId: edseee DbLabel: IEEE Xplore Digital Library An: edseee.11690339 RelevancyScore: 1178 AccessLevel: 2 PubType: Conference PubTypeId: conference PreciseRelevancyScore: 1177.97338867188 |
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| PLink | https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=edseee&AN=edseee.11690339 |
| RecordInfo | BibRecord: BibEntity: Identifiers: – Type: doi Value: 10.1109/ICEPT71373.2026.11690339 PhysicalDescription: Pagination: PageCount: 9 StartPage: 1 Titles: – TitleFull: Glass Packaging and Its Reliability Type: main BibRelationships: HasContributorRelationships: – PersonEntity: Name: NameFull: Lau, John H. IsPartOfRelationships: – BibEntity: Dates: – D: 05 M: 08 Type: published Y: 2026 Identifiers: – Type: isbn-print Value: 9798319531117 – Type: isbn-print Value: 9798319531124 – Type: issn-print Value: 28369734 – Type: issn-locals Value: edseee.IEEEConferenc Titles: – TitleFull: 2026 27th International Conference on Electronic Packaging Technology (ICEPT), Electronic Packaging Technology (ICEPT), 2026 27th International Conference on Type: main |
| ResultId | 1 |