Conference
Optimization and Reliability Investigation of Nano-Copper Sintering Technology for SiC MOSFET Devices
| Τίτλος: | Optimization and Reliability Investigation of Nano-Copper Sintering Technology for SiC MOSFET Devices |
|---|---|
| Συγγραφείς: | Yang, Lei, Qian, Jing, Wu, Lingmei, Huang, Yexiong, Chen, Xianping |
| Πηγή: | 2026 27th International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2026 27th International Conference on. :1-6 Aug, 2026 |
| Relation: | 2026 27th International Conference on Electronic Packaging Technology (ICEPT) |
| Βάση Δεδομένων: | IEEE Xplore Digital Library |
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