Fang, J., Zhang, W., Hu, L., Zeng, L., Fan, J., & Zhang, Y. (2026). Study on Heat Transfer and Phase Change Features of Metal Foam-Enhanced Phase Change Composites. 2026 27th International Conference on Electronic Packaging Technology (ICEPT), Electronic Packaging Technology (ICEPT), 2026 27th International Conference on, 1. https://doi.org/10.1109/ICEPT71373.2026.11690290
Παραπομπή σε μορφή Chicago (17η εκδ.)Fang, Jinsong, Weijian Zhang, Lingshuang Hu, Li Zeng, Jingyu Fan, και Yan Zhang. "Study on Heat Transfer and Phase Change Features of Metal Foam-Enhanced Phase Change Composites." 2026 27th International Conference on Electronic Packaging Technology (ICEPT), Electronic Packaging Technology (ICEPT), 2026 27th International Conference on 2026: 1. https://doi.org/10.1109/ICEPT71373.2026.11690290.
Παραπομπή σε μορφή MLA (9th εκδ.)Fang, Jinsong, et al. "Study on Heat Transfer and Phase Change Features of Metal Foam-Enhanced Phase Change Composites." 2026 27th International Conference on Electronic Packaging Technology (ICEPT), Electronic Packaging Technology (ICEPT), 2026 27th International Conference on, 2026, p. 1, https://doi.org/10.1109/ICEPT71373.2026.11690290.